Design for Manufacturability and Statistical Design: A Constructive ApproachSpringer Science & Business Media, 2007. gada 28. okt. - 316 lappuses Design for Manufacturability and Statistical Design: A Constructive Approach provides a thorough treatment of the causes of variability, methods for statistical data characterization, and techniques for modeling, analysis, and optimization of integrated circuits to improve yield. The objective of the constructive approach developed in this book is to formulate a consistent set of methods and principles necessary for rigorous statistical design and design for manufacturability from device physics to large-scale circuit optimization. The segments of the book are devoted, respectively, to
Design for Manufacturability and Statistical Design: A Constructive Approach presents an overview of the methods that need to be mastered for state-of-the-art design for manufacturability and statistical design methodologies. It is an important reference for practitioners and students in the field of computer-aided design of integrated circuits. |
No grāmatas satura
1.–5. rezultāts no 48.
... mask fabrication errors and mask overlay control, is limited. This results in an increase in the relative amount of variations observed. The third, and most profound, reason for the future increase in parametric variability is that ...
... masks was a straightforward task. As the industry migrated to sub-wavelength lithography, the difference between the drawn mask shapes and actual printed (wafer) regions began to increase. This resulted in the introduction of resolution ...
... mask fabrication and overlay control, is lagging behind [7]. However, the most profound reason for the future increase in parameter variability is that the technology is approaching the regime of fundamental randomness in the behavior ...
... masks are used in dual threshold voltage processes for making devices with low and high Vth, and (ii) different ... mask. These aberrations lead to predictable systematic spatial variation of the MOS gate length across the chip. For ...
... mask errors, variations in scanner/stepper illumination, lens aberrations, post-etch bake (PEB) temperature non-uniformity, and plasma etch rate non-uniformity [22]. From the designer's point of view most of these variability patterns ...
Saturs
1 | |
BACK END VARIABILITY 43 | 42 |
ENVIRONMENTAL VARIABILITY | 59 |
TEST STRUCTURES FOR VARIABILITY 85 | 84 |
STATISTICAL FOUNDATIONS OF DATA ANALYSIS | 101 |
Design Techniques for Systematic Manufacturability | 124 |
VARIABILITY | 152 |
STATISTICAL CIRCUIT ANALYSIS 167 | 166 |
STATISTICAL STATIC TIMING ANALYSIS | 201 |
LEAKAGE VARIABILITY AND JOINT PARAMETRIC | 239 |
PARAMETRIC YIELD OPTIMIZATION | 251 |
CONCLUSIONS 279 | 278 |
References | 291 |
Index | 309 |
Citi izdevumi - Skatīt visu
Design for Manufacturability and Statistical Design: A Constructive Approach Michael Orshansky,Sani Nassif,Duane Boning Priekšskatījums nav pieejams - 2007 |
Design for Manufacturability and Statistical Design: A Constructive Approach Michael Orshansky,Sani Nassif,Duane Boning Priekšskatījums nav pieejams - 2010 |