ONR Far East Scientific BulletinOffice of Naval Research, Liaison Office, Far East, 1987 |
No grāmatas satura
1.5. rezultāts no 65.
. lappuse
... Thermal plasmas Cold plasmas 19. ABSTRACT ( Continue on reverse if necessary and identify by block number ) This is a quarterly publication presenting articles covering recent developments in Far Eastern ( particularly Japanese ) ...
... Thermal plasmas Cold plasmas 19. ABSTRACT ( Continue on reverse if necessary and identify by block number ) This is a quarterly publication presenting articles covering recent developments in Far Eastern ( particularly Japanese ) ...
20. lappuse
... Thermal Plasmas vapor Papers on thermal plasmas were presented under six different cate- gories : basic processes and modeling , diagnostics , systems , melting and evaporation , metallurgy , and chemical synthesis and pyrolysis . The ...
... Thermal Plasmas vapor Papers on thermal plasmas were presented under six different cate- gories : basic processes and modeling , diagnostics , systems , melting and evaporation , metallurgy , and chemical synthesis and pyrolysis . The ...
21. lappuse
... thermal conductivity make dia- monds a unique material for multilayer semiconductors . INSTITUTE VISITS The Visits were made to two institutes of the Chinese Academy of Science : the Institute of Electrical Engineering and the Institute ...
... thermal conductivity make dia- monds a unique material for multilayer semiconductors . INSTITUTE VISITS The Visits were made to two institutes of the Chinese Academy of Science : the Institute of Electrical Engineering and the Institute ...
37. lappuse
... thermal calculations that are an integral part of the modeling of any high - performance , high - temperature system . In a number of instances in the past , comparisons have been made of the stress estimates calculated by different ...
... thermal calculations that are an integral part of the modeling of any high - performance , high - temperature system . In a number of instances in the past , comparisons have been made of the stress estimates calculated by different ...
43. lappuse
... Thermal stresses at the most severe operating conditions were estimated by finite element analysis . Some experimental verification of the calculated stresses was accomplished at low temperatures by means of strain gauges . The stress ...
... Thermal stresses at the most severe operating conditions were estimated by finite element analysis . Some experimental verification of the calculated stresses was accomplished at low temperatures by means of strain gauges . The stress ...
Bieži izmantoti vārdi un frāzes
11 National Circuit Academia Sinica alloys alumina analysis Appl applications Atomic Australia 11 National Beijing boundary layer carbon fiber Center ceramics CFRC chemical China Chiyoda-ku composites Congress crack crystal Department devices effect electrical electron energy Engineering epitaxy experimental fiber Figure film flaw flexural flow fracture toughness Fukuda GaAs growth Hashimoto industrial Institute of Technology International Conference ion beam ion implantation Ishida Japan Japanese Kyoto University laser materials mechanical metals meters method Minato-ku Miyauchi molecular beam epitaxy Nakashima Nanjing Naval Osaka oxide papers percent phase Phys Physics plasma Plasma Physics POSTECH presented processing Professor propeller radar reported Research Institute Sakyo-ku Science and Technology semi-insulating semiconductor Shanghai ship silicon nitride sintering Society Steel strength stress structure superconducting superlattices surface Symposium techniques temperature tensile thermal tion tokamak University of Tokyo velocity Wang wave
Populāri fragmenti
104. lappuse - Since 1963 he has been a Professor of Electrical Engineering and Computer Science at the University of Southern California, Los Angeles.
104. lappuse - He is a member of Eta Kappa Nu, Tau Beta Pi, and Sigma Xi.
50. lappuse - Ph.D. in naval architecture and marine engineering from the University of Michigan in 1980.
i. lappuse - Engineers 8b OFFICE SYMBOL (If applicable) 9. PROCUREMENT INSTRUMENT IDENTIFICATION NUMBER 8c. ADDRESS (City, State, and ZIP Code) Washington, DC 20314-1000 10.
109. lappuse - System," conducted under a program set by the Agency of Industrial Science and Technology, Ministry of International Trade and Industry.
81. lappuse - Institute for Medical and Dental Engineering, Tokyo Medical and Dental University, 2-3-10...
113. lappuse - Dept. of Physical Electronics, Tokyo Institute of Technology 2-12-1 Oh-okayama, Meguro-ku, Tokyo 152, Japan. ABSTRACT A novel technique has been proposed for selective and in-situ excimer-laser crystallization and doping to thin poly-Si films.
13. lappuse - A design method in which appropriate levels of structural reliability are provided, on a structural element (member) basis, by the specification of a number of partial safety factors related to some pre-defined characteristic values of the basic variables. Characteristic values are given as functions of mean values, coefficients of variation and distribution types.
i. lappuse - FORM 1473, 84 MAR 83 APR edition may be used until exhausted All other editions are obsolete SECURITY CLASSIFICATION OF THIS PAGE Unclassified FIELD Unclassified IICUNITV CLAMIPICATION or THIS 6a.