 3-D ICs: A novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration, Proc. IEEE, 89, 602, 2001. [5] Miller, DAB Rationale and challenges for optical interconnects to electronic chips, Proc. IEEE, 88,...  Low-Power Electronics Design - 5-21. lappuselaboja - 2018 - 912 lapasIerobežota priekšskatīšana - Par šo grāmatu
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...laminated polymer fibre circuits.” I Opt. A: Pure App!. Opt. 1: 239—243. 108. Miller, DAB 2000. “Rationale and challenges for optical interconnects to electronic chips.” Proc. IEEE 88: 728—749. 109. The Semiconductor Industry Association's (SIA's) National Technology Roadmapfor Semiconductors,... | |
 | A. Miller, D.T. Reid, D.M. Finlayson - 2019 - 382 lapas
...Summer School in Physics, SUSSP Publications, and Institute of Physics Publishing) Miller DAB, 2000, 'Rationale and Challenges for Optical Interconnects to Electronic Chips', Proc. IEEE 88 728 Nelson BE, Gerken M, Miller DAB, Piestun R, Lin CC and Harris JS, Jr., 2000, 'Use of a Dielectric Stack... | |
 | Lorenzo Pavesi - 2004 - 424 lapas
...(Intel Corp., Web address: http://www.intel.com/labs/microarch/publications.htm 2002) 4. DAB Miller: Rationale and Challenges for Optical Interconnects to Electronic Chips, Proc. IEEE 88, 728—749 (2000) 5. International Technology Roadmap for Semiconductors, 2001 EDITION, INTERCONNECT,... | |
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