Thermal Testing of Integrated CircuitsSpringer Science & Business Media, 2002. gada 30. jūn. - 204 lappuses Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. Abnormal status of this variable, both too high and too low, is sign of abnormal behavior in electronic systems. In Thermal Testing of Integrated Circuits the authors present the feasibility to consider temperature as an observable for testing purposes. The coupling of circuits through heat is inherent to the solid-state nature and the inspection of temperature does not interact with Under Test Circuits or Systems, something that does not happen when voltage or current observable are used. In the book the basis of heat propagation, heat conducting mechanisms and temperature sensitivity of semiconductors are focused with a full coverage of the state of the art. We usually have the idea that all the heating processes are slow, which is true in the macroscopic world, but is not in the case of integrated circuits where the reduced size and amount of material and the really high conductivity of substrates make the thermal testing a promising technique. CMOS and BICMOS temperature sensors for built-in thermal testing are presented in the book. The application of temperature as testing magnitude for both on-line and off-line, analog or digital, on-chip or off-chip are considered. The temperature sensing has an inherent directional capability that can be used as an element for localizing failures, so the technique has interesting diagnosis capabilities as well. |
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amplitude application axis behaviour bipolar transistors boundary conditions bridge capacitance chapter chip CMOS constant convection depends Design differential temperature sensor Dilhaire dissipated power distance effect electrical electro-thermal electronic energy example fault models fault-free Figure frequency gate GOS defect heat conduction heat flow heat sink heat source dissipates IC's IDDQ testing IEEE IEEE Journal IEEE Transactions integrated circuits laser layers linear liquid crystal logic gate logic transition magnitude manufacturing mechanism methods MOS transistor NMOS obtained output node oxide p-n junctions package parameters perform phase PMOS power dissipated quiescent radiation region Rencz semiconductor sensitivity shows silicon surface simulations static structure Székely temperature increase temperature measurements temperature monitoring point temperature transducers temperature waveform test vectors testing procedure thermal analysis thermal coupling thermal disturbance thermal map thermal resistance thermal testing thermography threshold voltage topology transfer function transformed VLSI
Atsauces uz šo grāmatu
System-on-chip Test Architectures: Nanometer Design for Testability Laung-Terng Wang,Charles E. Stroud,Nur A. Touba Priekšskatījums nav pieejams - 2008 |